Tongfu Microelectronics Co.,Ltd (002156.SZ)

Total liabilities on the balance sheet as of June 2025 : HK$28.36 Billion

According to Tongfu Microelectronics Co.,Ltd's latest financial reports the company's total liabilities are HK$28.36 Billion. A company’s total liabilities is the sum of all current and non-current debts and obligations.

Tongfu Microelectronics Co.,Ltd - Total liabilities on balance sheet (from 2006 to 2025)

Total liabilities by year

Year	Total liabilities	Change
2024-12-31	HK$25.13 B	12.71%
2023-12-31	HK$22.30 B	-6.6%
2022-12-31	HK$23.87 B	21.35%
2021-12-31	HK$19.67 B	47.59%
2020-12-31	HK$13.33 B	23.85%
2019-12-31	HK$10.76 B	26.62%
2018-12-31	HK$8.50 B	20.22%
2017-12-31	HK$7.07 B	25.1%
2016-12-31	HK$5.65 B	70.54%
2015-12-31	HK$3.31 B	66.35%
2014-12-31	HK$1.99 B	8.73%
2013-12-31	HK$1.83 B	25.58%
2012-12-31	HK$1.45 B	-2.39%
2011-12-31	HK$1.49 B	-15.43%
2010-12-31	HK$1.76 B	51.17%
2009-12-31	HK$1.16 B	18.64%
2008-12-31	HK$0.98 B	-15.36%
2007-12-31	HK$1.16 B	7.96%
2006-12-31	HK$1.07 B	14.7%
2005-12-31	HK$0.94 B	34.73%
2004-12-31	HK$0.69 B

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Tongfu Microelectronics Co.,Ltd (002156.SZ) - Total liabilities