SAMSUNG S&P High Dividend APAC ex NZ REITs ETF
3187.HK
#3237
ETF rang
€13.32 M
Capitalisation boursière
🇭🇰 HK
Marché
1,80 €
Prix de l'action
1.30%
Changement (1 jour)
-2.96%
Changement (1 an)

SAMSUNG S&P High Dividend APAC ex NZ REITs ETF - Composition

Composition de l'ETF au 17 Août, 2026Nombre de participations : 30

Liste complète de la composition

Poids %NomSymbole
10.33%
STOCKLANDSGP
9.91%
CAPITALAND INTERGRATED COMMERCICT
9.70%
LINK REIT823
6.96%
MIRVAC GROUPMGR
6.27%
DEXUS/AUDXS
4.23%
JAPAN METROPOLITAN FUND INVE8953
3.44%
MAPLETREE INDUSTRIAL TRUSTMINT
3.40%
GLP J-REIT3281
3.35%
MAPLETREE LOGISTICS TRUSTMLT
3.23%
KDX REALTY INVESTMENT CORP8972
2.76%
DAIWA HOUSE REIT INVESTMENT8984
2.75%
REGION GROUPRGN
2.71%
UNITED URBAN INVESTMENT CORP8960
2.58%
FRASERS CENTREPOINT TRUSTFCT
2.49%
JAPAN HOTEL REIT INVESTMENT8985
2.43%
INVINCIBLE INVESTMENT CORP8963
2.43%
CHARTER HALL LONG WALE REITCLW
2.41%
MAPLETREE PAN ASIA COM TRUSTMPACT
2.39%
FRASERS LOGISTICS & COMMERCIFLT
2.37%
KEPPEL REITKREIT
2.11%
CHARTER HALL RETAIL REITCQR
1.97%
CAPITALAND ASCOTT TRUSTCLAS
1.89%
INDUSTRIAL & INFRASTRUCTURE3249
1.69%
SEKISUI HOUSE REIT INC3309
1.36%
LASALLE LOGIPORT REIT3466
1.18%
LENDLEASE GLOBAL COMMERCIALLREIT
1.10%
AEON REIT INVESTMENT CORP3292
1.09%
MITSUI FUDOSAN RETAIL FUND I8964
0.81%
HEIWA REAL ESTATE REIT INC8966
0.67%
GLOBAL ONE REIT8958